AI Data Center Liquid Cooling Pipe Selection Guide

AI data center cooling represents the newest and fastest-growing application for precision stainless steel tube. With NVIDIA NVL72 racks generating 100-120 kW of heat, direct-to-chip liquid cooling requires ultra-high-purity tube with demanding surface finish and helium leak specifications.

Cooling System Service Zones

ServiceMaterialSpecificationKey Requirement
CDU-to-Rack Supply/Return316L ElectropolishedRa ≤ 0.4 μm ID, He leak ≤ 10⁻⁹NVIDIA NVL72 Core Requirement
Rack Manifold Headers316L Bright AnnealedRa ≤ 0.8 μm IDDistribution piping
Facility Water Loop304L WeldedASTM A312, SCH 10SCost-effective for large diameters
Heat Rejection (Cooling Tower)316L WeldedASTM A358Chloride resistance for treated water
Instrument & Sensing Lines316L SeamlessOD 6-12mm, bright annealedPrecision small-diameter
Ra ≤ 0.4 μm
CDU Core Surface Finish
10⁻⁹ Pa·m³/s
Helium Leak Rate
100-120 kW
Per Rack Heat Load
20-35 Tons
Per 100 MW DC